High Precision Aluminum Stainless Steel SPHC SPCC Sheet Metal Stamping Part

The following steps are often included in the oxidation process:
1. Raw material feeding: Use pipes to provide the raw materials to the reactor in order to maintain the proper balance of raw materials within.
2. Reaction: To carry out the oxidation reaction, add oxygen to the reactor and regulate the reaction parameters (such as temperature, pressure, and reaction time).
3. Product separation: Use an air cooler to chill the reacted product, turn it from a gaseous state into a liquid or solid form, and then use a separator to separate the products originating from various components.
4. Purification: To ensure that the reaction product reaches the necessary purity, purify it.

5. Packaging: After the products are purified, they are packaged in accordance with guidelines and standards before being either sold to clients or sent on to the next stage of processing.
In certain specialized applications, like semiconductor wafer fabrication, the oxidation process additionally includes applying heat energy and oxidants (such oxygen and water) to the silicon substrate in order to generate a silicon dioxide (SiO2) coating. This oxide film serves as an anti-etching layer to shield the wafer from inadvertent etching during the etching process, stops diffusion during the ion implantation process, and stops leakage current from passing across circuits.